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In semiconductor device fabrication, the processing steps fall into four general categories, deposition, removal, patterning. Microcontroller-based system on a chip. A multi-core processor implements multiprocessing in a physical package. Samsung Galaxy Core 2 price, specifications, features, comparison gadgets. Once the architecture of the SoC has been defined, any new elements are written in an abstract language termed RTL which defines the circuit behaviour. Check out our top picks in multiple categories, plus the latest rumors on

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14.02.2018 - The 32 nm process was superseded by commercial 22 nm technology inprototypes using 32 nm technology first emerged in the mids. Intel and AMD both produced commercial microchips using the 32 nanometer process in the early s, IBM and the Common Platform also developed a 32 nm high-k metal gate process. The oleophobic coating of the iPhone is meant to repel fingerprint oils. The hardware tracing modules are compatible, but updated, versions of those used in the ARM9, in particular, trace semantics were updated to address parallel instruction execution and data transfers.

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As long as we remember that the SoC does not necessarily contain built-in memory, in general, we can distinguish three types of SoC. When it is not feasible to construct a SoC for a particular application, in large volumes, SoC is believed to be more cost-effective than SiP since it increases the yield of the fabrication and because its packaging is simpler.

Another option, as seen for example in cell phones, is package on package stacking during board assembly. The SoC includes processors and numerous digital peripherals, and comes in a ball grid package with lower and upper connections.

The lower balls connect to the board and various peripherals, with the balls in a ring holding the memory buses used to access NAND flash. Memory packages could come from multiple vendors, DMA controllers route data directly between external interfaces and memory, bypassing the processor core and thereby increasing the data throughput of the SoC.

A SoC consists of both the hardware, described above, and the controlling the microcontroller, microprocessor or DSP cores, peripherals. The design flow for a SoC aims to develop hardware and software in parallel.

Most SoCs are developed from pre-qualified hardware blocks for the elements described above. Of particular importance are the protocol stacks that drive industry-standard interfaces like USB, the hardware blocks are put together using CAD tools, the software modules are integrated using a software-development environment.

Once the architecture of the SoC has been defined, any new elements are written in an abstract language termed RTL which defines the circuit behaviour. These elements are connected together in the same RTL language to create the full SoC design, chips are verified for logical correctness before being sent to foundry.

This process is called functional verification and it accounts for a significant portion of the time, with the growing complexity of chips, hardware verification languages like SystemVerilog, SystemC, e, and OpenVera are being used.

Bugs found in the stage are reported to the designer. It is a member of the MT62xx series of processors by MediaTek, mediaTek-based Chinese cell phones often come with features not common to North American phones, such as analog television viewing and recording.

While these phones have vastly different builds and configurations, they all run on a proprietary operating system based on the Nucleus RTOS. Instruction set architecture — An ISA includes a specification of the set of opcodes, and the native commands implemented by a particular processor.

An instruction set architecture is distinguished from a microarchitecture, which is the set of design techniques used, in a particular processor. Processors with different microarchitectures can share a common instruction set, for example, the Intel Pentium and the AMD Athlon implement nearly identical versions of the x86 instruction set, but have radically different internal designs.

Prior to NPL, the companys computer designers had been free to honor cost objectives not only by selecting technologies, the SPREAD compatibility objective, in contrast, postulated a single architecture for a series of five processors spanning a wide range of cost and performance.

In addition, these virtual machines execute less frequently used code paths by interpretation, transmeta implemented the x86 instruction set atop VLIW processors in this fashion. A complex instruction set computer has many specialized instructions, some of which may only be used in practical programs.

Theoretically important types are the instruction set computer and the one instruction set computer. Another variation is the very long instruction word where the processor receives many instructions encoded and retrieved in one instruction word, machine language is built up from discrete statements or instructions.

Examples of operations common to many instruction sets include, Set a register to a constant value. Copy data from a location to a register, or vice versa. Used to store the contents of a register, result of a computation, often called load and store operations.

Read and write data from hardware devices, add, subtract, multiply, or divide the values of two registers, placing the result in a register, possibly setting one or more condition codes in a status register.

Increment, decrement in some ISAs, saving operand fetch in trivial cases, perform bitwise operations, e. Floating-point instructions for arithmetic on floating-point numbers, branch to another location in the program and execute instructions there.

Conditionally branch to another if a certain condition holds. Call another block of code, while saving the location of the instruction as a point to return to. Semiconductor device fabrication — Semiconductor device fabrication is the process used to create the integrated circuits that are present in everyday electrical and electronic devices.

It is a sequence of photo lithographic and chemical processing steps during which electronic circuits are gradually created on a wafer made of pure semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications, the entire manufacturing process, from start to packaged chips ready for shipment, takes six to eight weeks and is performed in highly specialized facilities referred to as fabs.

When feature widths were far greater than about 10 micrometres, purity was not the issue that it is today in device manufacturing, as devices became more integrated, cleanrooms became even cleaner.

Today, the fabs are pressurized with filtered air to remove even the smallest particles, the workers in a semiconductor fabrication facility are required to wear cleanroom suits to protect the devices from human contamination.

Semiconductor device manufacturing has spread from Texas and California in the s to the rest of the world, including Europe, the Middle East and it is a global business today. The leading semiconductor manufacturers typically have facilities all over the world, intel, the worlds largest manufacturer, has facilities in Europe and Asia as well as the U.

A typical wafer is made out of pure silicon that is grown into mono-crystalline cylindrical ingots up to mm in diameter using the Czochralski process. These ingots are sliced into wafers about 0.

In semiconductor device fabrication, the processing steps fall into four general categories, deposition, removal, patterning. Deposition is any process that grows, coats, or otherwise transfers a material onto the wafer, available technologies include physical vapor deposition, chemical vapor deposition, electrochemical deposition, molecular beam epitaxy and more recently, atomic layer deposition among others.

Removal is any process that removes material from the wafer, examples include etch processes, patterning is the shaping or altering of deposited materials, and is generally referred to as lithography.

After etching or other processing, the remaining photoresist is removed by plasma ashing, modification of electrical properties has historically entailed doping transistor sources and drains.

These doping processes are followed by annealing or, in advanced devices. Modification of electrical properties now also extends to the reduction of a dielectric constant in low-k insulators via exposure to ultraviolet light in UV processing.

Modern chips have up to eleven metal levels produced in over sequenced processing steps, FEOL processing refers to the formation of the transistors directly in the silicon. The raw wafer is engineered by the growth of an ultrapure, in the most advanced logic devices, prior to the silicon epitaxy step, tricks are performed to improve the performance of the transistors to be built.

One method involves introducing a straining step wherein a silicon variant such as silicon-germanium is deposited, once the epitaxial silicon is deposited, the crystal lattice becomes stretched somewhat, resulting in improved electronic mobility.

With this design generation, ARM moved from a von Neumann architecture to a Harvard architecture with separate instruction and data buses, there are two subfamilies, implementing different ARM architecture versions.

Key improvements over ARM7 cores, enabled by spending more transistors, include, Decreased heat production, shifting from a three-stage pipeline to a five-stage one lets the clock speed be approximately doubled, on the same silicon fabrication process.

This is helped by both the modified Harvard architecture and the new pipeline stages, exposing pipeline interlocks, enabling compiler optimizations to reduce blockage between stages.

Additionally, some ARM9 cores incorporate Enhanced DSP instructions, such as a multiply-accumulate, switching to from a von Neumann architecture entailed a non-unified cache, so that instruction fetches do not evict data.

ARM9 cores have separate data and address bus signals, which chip designers use in various ways, such hybrids are no longer pure Harvard architecture processors.

Integrated device manufacturers receive the ARM Processor IP as synthesizable RTL, in this form, they have the ability to perform architectural level optimizations and extensions.

This allows the manufacturer to achieve custom design goals, such as higher speed, very low power consumption, instruction set extensions, optimizations for size, debug support. The ARM MPCore family of multicore processors support software written using either the asymmetric or symmetric multiprocessor programming paradigms, for AMP development, each central processor unit within the MPCore may be viewed as an independent processor and as such can follow traditional single processor development strategies.

In addition, the multiplier unit width has been doubled, halving the time required for most multiplication operations and they support bit, bit, and sometimes 8-bit instruction sets.

The total documentation is especially hard to grasp for all ARM chips since it consists of documents from the IC manufacturer, documentation tree IC manufacturer marketing slides.

IC manufacturer has additional documents, including, evaluation board user manuals, application notes, getting started with development software, software library documents, errata, other Yurichev, Dennis, An Introduction To Reverse Engineering for Beginners including ARM assembly.

ARM7 cores are no longer recommended for new designs, instead ARM Cortex-M or ARM Cortex-R cores should be considered and this generation introduced the Thumb bit instruction set providing improved code density compared to previous designs.

The most widely used ARM7 designs implement the ARMv4T architecture, all these designs use a Von Neumann architecture, thus the few versions comprising a cache do not separate data and instruction caches.

Subsequent cores included and enhanced this support and it is a versatile processor designed for mobile devices and other low power electronics. This processor architecture is capable of up to MIPS on a typical 0.

The processor supports both bit and bit instructions via the ARM and Thumb instruction sets, ARM licenses the processor to various semiconductor companies, which design full chips based on the ARM processor architecture.

Nokia, released in, is similar to the but has a larger 2. Nokia was announced in January, like the, the has a 2. Nokia is a device announced in August, the differentiation from its predecessors is that it comes with Skypes GroupMe application preinstalled.

Nokia launched in November and this device features front facing and main camera both with LED flash. Smartwatch — A smartwatch is a computerized wristwatch with functionality that goes beyond timekeeping.

While early models can perform tasks, such as calculations, translations. Many run mobile apps, using an operating system. Some smartwatches function as media players, with FM radio and playback of digital audio.

Some models, also called watch phones, feature full mobile phone capability, while internal hardware varies, most have an electronic visual display, either backlit LCD or OLED.

Some use transflective or electronic paper, to less power. Most have a battery and many have a touchscreen. Peripheral devices may include digital cameras, thermometers, accelerometers, altimeters, barometers, compasses, GPS receivers, tiny speakers, software may include digital maps, schedulers and personal organizers, calculators, and various kinds of watch faces.

The watch may communicate with devices such as sensors, wireless headsets. Like other computers, a smartwatch may collect information from internal or external sensors and it may control, or retrieve data from and it may support wireless technologies like Bluetooth, Wi-Fi, and GPS.

For many purposes, a wristwatch computer serves as a front end for a system such as a smartphone. Smartwatches are advancing, especially their design, battery capacity, many smartwatch models manufactured in the s are completely functional as standalone products.

Some serve as sport watches, the GPS tracking unit being used to record historical data, for example, after a workout, data can be uploaded onto a computer or online to create a log of activities for analysis or sharing.

Some watches can serve as full GPS watches, displaying maps and current coordinates, users can mark their current location and then edit the entrys name and coordinates, which enables navigation to those new coordinates.

As companies add competitive products into the market, media space is becoming a commodity on smart watches. With Apple, Sony, Samsung, and Motorola introducing their smart watch models and this is a dense market of tech consumers who possess buying power, which has attracted many advertisers.

It is expected for mobile advertising on wearable devices to increase heavily by as advanced hypertargeting modules are introduced to the devices. In order for an advertisement to be effective on a smart watch, sport watch functionality often includes activity tracker features as seen in GPS watches made for training, diving, and outdoor sports.

Ampere hour — The commonly seen milliampere hour is one-thousandth of an ampere hour. The ampere hour is used in measurements of electrochemical systems such as electroplating. A milliampere second is a unit of measure used in X-ray imaging, diagnostic imaging and this quantity is proportional to the total X-ray energy produced by a given X-ray tube operated at a particular voltage.

The same total dose can be delivered in different time periods depending on the X-ray tube current, an ampere hour is not a unit of energy. In a battery system, for example, accurate calculation of the energy delivered requires integration of the power delivered over the discharge interval, generally, the battery voltage varies during discharge, an average value or nominal value may be used to approximate the integration of power.

The Faraday constant is the charge on one mole of electrons and it is used in electrochemical calculations. An AA size dry cell has a capacity of about 2 to 3 ampere hours, automotive car batteries vary in capacity but a large automobile propelled by an internal combustion engine would have about a 50 ampere hour battery capacity.

Since one ampere hour can produce 0. These include SIMD media instructions, multiprocessor support and a new cache architecture, the implementation included a significantly improved instruction processing pipeline, compared to previous ARM9 or ARM10 families, and is used in smartphones from Apple, Nokia, and others.

The hardware tracing modules are compatible, but updated, versions of those used in the ARM9, in particular, trace semantics were updated to address parallel instruction execution and data transfers.

ARM makes an effort to promote good Verilog coding styles and techniques and this ensures semantically rigorous designs, preserving identical semantics throughout the chip design flow, which included extensive use of formal verification techniques.

Without such attention, integrating an ARM11 with third-party designs could risk exposing hard-to-find latent bugs, the ARM11 generation focused more on synthesis than previous generations, making such concerns be more of an issue.

MX3x series, such as i. PowerVR introduced new versions with low-power electronics that were aimed at the computer market. Over time, this developed into a series of designs that could be incorporated into system-on-a-chip architectures suitable for handheld device use, as the polygon generating program feeds triangles to the PowerVR, it stores them in memory in a triangle strip or an indexed format.

Unlike other architectures, polygon rendering is not performed until all polygon information has been collated for the current frame. Furthermore, the operations of texturing and shading of pixels is delayed, whenever possible.

In order to render, the display is split into sections in a grid pattern. Each section is known as a tile, associated with each tile is a list of the triangles that visibly overlap that tile. Each tile is rendered in turn to produce the final image, tiles are rendered using a process similar to ray-casting.

Rays are numerically simulated as if cast onto the triangles associated with the tile, the PowerVR hardware typically calculates the depths associated with each polygon for one tile row in 1 cycle.

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Deposition is any process that grows, coats, or otherwise transfers a material onto the wafer, available technologies include physical vapor deposition, chemical vapor deposition, electrochemical deposition, molecular beam epitaxy and more recently, atomic layer deposition among others.

After etching or other processing, the remaining photoresist is removed by plasma ashing, modification of electrical properties has historically entailed doping transistor sources and drains.

This is helped by both the modified Harvard architecture and the new pipeline stages, exposing pipeline interlocks, enabling compiler optimizations to reduce blockage between stages.

ARM9 cores have separate data and address bus signals, which chip designers use in various ways, such hybrids are no longer pure Harvard architecture processors.

Integrated device manufacturers receive the ARM Processor IP as synthesizable RTL, in this form, they have the ability to perform architectural level optimizations and extensions. This allows the manufacturer to achieve custom design goals, such as higher speed, very low power consumption, instruction set extensions, optimizations for size, debug support.

The ARM MPCore family of multicore processors support software written using either the asymmetric or symmetric multiprocessor programming paradigms, for AMP development, each central processor unit within the MPCore may be viewed as an independent processor and as such can follow traditional single processor development strategies.

In addition, the multiplier unit width has been doubled, halving the time required for most multiplication operations and they support bit, bit, and sometimes 8-bit instruction sets.

The total documentation is especially hard to grasp for all ARM chips since it consists of documents from the IC manufacturer, documentation tree IC manufacturer marketing slides.

Some models, also called watch phones, feature full mobile phone capability, while internal hardware varies, most have an electronic visual display, either backlit LCD or OLED.

Ampere hour — The commonly seen milliampere hour is one-thousandth of an ampere hour. The ampere hour is used in measurements of electrochemical systems such as electroplating.

A milliampere second is a unit of measure used in X-ray imaging, diagnostic imaging and this quantity is proportional to the total X-ray energy produced by a given X-ray tube operated at a particular voltage.

The hardware tracing modules are compatible, but updated, versions of those used in the ARM9, in particular, trace semantics were updated to address parallel instruction execution and data transfers.

In order to render, the display is split into sections in a grid pattern. Each section is known as a tile, associated with each tile is a list of the triangles that visibly overlap that tile.

Each tile is rendered in turn to produce the final image, tiles are rendered using a process similar to ray-casting. Rays are numerically simulated as if cast onto the triangles associated with the tile, the PowerVR hardware typically calculates the depths associated with each polygon for one tile row in 1 cycle.

It also allows for correct rendering of partially transparent polygons, independent of the order in which they are processed by the polygon producing application. More importantly, as the rendering is limited to one tile at a time, the tile can be in fast on-chip memory.

Under normal circumstances, each tile is visited just once per frame, PowerVR is a pioneer of tile based deferred rendering. Microsoft also conceptualised the idea with their abandoned Talisman project, gigapixel, a company that developed IP for tile-based deferred 3D graphics, was purchased by 3dfx, which in turn was subsequently purchased by Nvidia.

Nvidia now uses a form of rendering in the Maxwell. ARM began developing another major tile based deferred rendering architecture known as Mali after their acquisition of Falanx, Intel uses a similar concept in their integrated graphics solutions.

As part of a competition at Sega to design the successor to the Saturn. It also designs cores that implement this instruction set and licenses these designs to a number of companies that incorporate those core designs into their own products, a RISC-based computer design approach means processors require fewer transistors than typical complex instruction set computing x86 processors in most personal computers.

For supercomputers, which large amounts of electricity, ARM could also be a power-efficient solution. ARM Holdings periodically releases updates to architectures and core designs, some older cores can also provide hardware execution of Java bytecodes.

The ARMv8-A architecture, announced in October, adds support for a bit address space, with over billion ARM processors produced as of, ARM is the most widely used instruction set architecture in terms of quantity produced.

Currently, the widely used Cortex cores, older classic cores, the British computer manufacturer Acorn Computers first developed the Acorn RISC Machine architecture in the s to use in its personal computers.

After testing all available processors and finding them lacking, Acorn decided it needed a new architecture, inspired by white papers on the Berkeley RISC project, Acorn considered designing its own processor.

Hauser gave his approval and assembled a team to implement Wilsons model in hardware. Wilson and Furber led the design and they implemented it with a similar efficiency ethos as the The in-depth knowledge gained from designing the instruction set enabled the code to be very dense, the original aim of a principally ARM-based computer was achieved in with the release of the Acorn Archimedes.

Operating system is Android 4. The screen is a 3. Multi-core processor — A multi-core processor is a single computing component with two or more independent actual processing units, which are units that read and execute program instructions.

The instructions are ordinary CPU instructions, but the multiple cores can run multiple instructions at the same time, manufacturers typically integrate the cores onto a single integrated circuit die, or onto multiple dies in a single chip package.

A multi-core processor implements multiprocessing in a physical package. Designers may couple cores in a multi-core device tightly or loosely, for example, cores may or may not share caches, and they may implement message passing or shared-memory inter-core communication methods.

Common network topologies to interconnect cores include bus, ring, two-dimensional mesh, homogeneous multi-core systems include only identical cores, heterogeneous multi-core systems have cores that are not identical.

Just as with single-processor systems, cores in multi-core systems may implement architectures such as VLIW, superscalar, Multi-core processors are widely used across many application domains, including general-purpose, embedded, network, digital signal processing, and graphics.

The improvement in performance gained by the use of a multi-core processor depends very much on the algorithms used. In particular, possible gains are limited by the fraction of the software that can run in parallel simultaneously on multiple cores, most applications, however, are not accelerated so much unless programmers invest a prohibitive amount of effort in re-factoring the whole problem.

The parallelization of software is a significant ongoing topic of research, the terms multi-core and dual-core most commonly refer to some sort of central processing unit, but are sometimes also applied to digital signal processors and system on a chip.

This article uses the terms multi-core and dual-core for CPUs manufactured on the integrated circuit. In contrast to systems, the term multi-CPU refers to multiple physically separate processing-units.

The terms many-core and massively multi-core are sometimes used to describe multi-core architectures with a high number of cores. Some systems use many soft microprocessor cores placed on a single FPGA, each core can be considered a semiconductor intellectual property core as well as a CPU core.

While manufacturing technology improves, reducing the size of individual gates and these physical limitations can cause significant heat dissipation and data synchronization problems.

Various other methods are used to improve CPU performance, some instruction-level parallelism methods such as superscalar pipelining are suitable for many applications, but are inefficient for others that contain difficult-to-predict code.

Many applications are better suited to thread-level parallelism methods, and multiple independent CPUs are commonly used to increase a systems overall TLP, a combination of increased available space and the demand for increased TLP led to the development of multi-core CPUs.

Several business motives drive the development of multi-core architectures, for decades, it was possible to improve performance of a CPU by shrinking the area of the integrated circuit, which reduced the cost per device on the IC.

Alternatively, for the circuit area, more transistors could be used in the design. Intel and AMD both produced commercial microchips using the 32 nanometer process in the early s, IBM and the Common Platform also developed a 32 nm high-k metal gate process.

Intel began selling its first 32 nm processors using the Westmere architecture on 7 January,28 nanometer was an intermediate half-node die shrink based on the 32 nanometer process. The 32 nm process was superseded by commercial 22 nm technology in, prototypes using 32 nm technology first emerged in the mids.

In, IBM demonstrated a 0. In October, the Interuniversity Microelectronics Centre demonstrated a 32 nm flash patterning capability based on double patterning, the necessity of introducing double patterning and hyper-NA tools to reduce memory cell area offset some of the cost advantages of moving to this node from the 45 nm node.

TSMC similarly used double patterning combined with immersion lithography to produce a 32 nm node 0. If there's no contract, I can leave Verizon anytime, right?

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Additionally, manufacturers has started applying oleophobic coating on top of its Which one is better for handsets Gorilla Glass or oleophobic The oleophobic coating of the iPhone is meant to repel fingerprint oils.

Corning Gorilla Glass is a scratch resistant glass with a brand name. Oleophobic coating — what it is, how to clean your phone, what to do if Gorilla Glass cover glass applications include Corning also picks their kind of glass carefully.

How Corning won Apple back and built the strongest Gorilla Glass yet Vibrant Gorilla Glass is a new offer from Corning. Micromax Canvas Unite 4 Plus. Micromax Canvas Juice 4G Q The phones also feature Corning Gorilla Glass screen protection.

Check out their reviews, specifications, It has a Micromax Canvas Spark 3 With 5. Launched recently by Micromax, this smartphone is perhaps the Micromax Corning Gorilla Glass https: Micromax started a range of its premium and quality smartphones.

The highlight of the handset is its massivebattery capacity of mAh. The highlight of the Oukitel K is its mAhbattery capacity, which is strides ahead from the current Battery capacity in terms of how long a battery can last in a phone seem to have become a major determinant to how well a phone will do in the Top 5 Smartphones with longer battery life - Mobile Yantra www.

I found it works great with real mAh, can charge mine for 4 times, Thesmartphones in this list have great battery life and capacity with, This external battery charger can have any digital devices, the standard USB port to charge.

How many charges does the mAh or mAh battery power This is a difficult question to answer but we will give you all the relevant details and hopefully that will help you understand power Shop online for Samsung Original Mobile Battery This is incredibly frustrating--I know it's for older model phones, but it really shouldn't require a degree in engineering to find a Look no further, it is right here Charge the initial hour battery charge with the cell phone turned off.

Note that a new lithium ion batterys I should have figured it was too good of a price to be a true new battery, and it was. All it ended up being was a waste.

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03.02.2018 Kazragami :

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